Mechanical probe station
Encyclopedia
A Mechanical probe station is used to physically acquire signals from the internal nodes of a semiconductor device. The probe station utilizes manipulators which allow the precise positioning of thin needles on the surface of a semiconductor device. If the device is being electrically stimulated, the signal is acquired by the mechanical probe and is displayed on an oscilloscope
. The mechanical probe station is often used in the failure analysis
of semiconductor devices.
There are two types of mechanical probes: active and passive. Passive probes usually consist of a thin tungsten needle. Active probes utilize a FET device on the probe tip in order to significantly reduce loading on the circuit.
. It is often faster and more flexible to test a new electronic device or sample with a probe station than to wire bond
and package the device before testing.
Oscilloscope
An oscilloscope is a type of electronic test instrument that allows observation of constantly varying signal voltages, usually as a two-dimensional graph of one or more electrical potential differences using the vertical or 'Y' axis, plotted as a function of time,...
. The mechanical probe station is often used in the failure analysis
Failure analysis
Failure analysis is the process of collecting and analyzing data to determine the cause of a failure. It is an important discipline in many branches of manufacturing industry, such as the electronics industry, where it is a vital tool used in the development of new products and for the improvement...
of semiconductor devices.
There are two types of mechanical probes: active and passive. Passive probes usually consist of a thin tungsten needle. Active probes utilize a FET device on the probe tip in order to significantly reduce loading on the circuit.
Research
Mechanical probe stations are often used in academic research on electronics and materials scienceMaterials science
Materials science is an interdisciplinary field applying the properties of matter to various areas of science and engineering. This scientific field investigates the relationship between the structure of materials at atomic or molecular scales and their macroscopic properties. It incorporates...
. It is often faster and more flexible to test a new electronic device or sample with a probe station than to wire bond
Wire bonding
Wire bonding is the primary method of making interconnections between an integrated circuit and a printed circuit board during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another...
and package the device before testing.