Wafer-level packaging is the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package

Chip scale package

A chip scale package is a type of integrated circuit chip carrier.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging...

 (CSP) technology, since the resulting package is practically of the same size as the die.. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

Wafer-level packaging basically consists of extending the wafer fab processes to include device interconnection and device protection processes.
Most other kinds of packaging does wafer dicing

Wafer dicing

Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing or by laser cutting...

 first, and then puts the individual die in a plastic package and attaches the solder bumps.
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuit while still in the wafer, and then wafer dicing

Wafer dicing

Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing or by laser cutting...

.

There is no single industry-standard method of wafer-level packaging at present.

External links

• Wafer-Level Packaging – From SiliconFarEast.com