Chip scale package
Encyclopedia
A chip scale package (sometimes, chip-scale package with a hyphen) is a type of integrated circuit
chip carrier
.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC
’s standard J-STD-012, "Implementation of Flip Chip and Chip Scale Technology", in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die
and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The concept was first proposed by Junichi Kasai of Fujitsu
and Gen Mukarami of Hitachi Cable
. The first concept demonstration however came from Mitsubishi Electric
.
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip
ball grid array
(BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level chip-scale package (WL-CSP) or a wafer-level package (WLP).
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
chip carrier
Chip carrier
A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC
IPC (electronics)
IPC, the Association Connecting Electronics Industries, is an organization whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. It was founded in 1957 as the Institute for Printed Circuits...
’s standard J-STD-012, "Implementation of Flip Chip and Chip Scale Technology", in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die
Die (integrated circuit)
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The concept was first proposed by Junichi Kasai of Fujitsu
Fujitsu
is a Japanese multinational information technology equipment and services company headquartered in Tokyo, Japan. It is the world's third-largest IT services provider measured by revenues....
and Gen Mukarami of Hitachi Cable
Hitachi Cable
was established in 1956 as a manufacturer of electric wire and cable for power distribution. The company, based in Tokyo, Japan, was formed from Hitachi Densen Works, the Hitachi Works spin-off previously known as Densen Works of....
. The first concept demonstration however came from Mitsubishi Electric
Mitsubishi Electric
is a multinational electronics and information technology company headquartered in Tokyo, Japan. It is one of the core companies of the Mitsubishi Group....
.
The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip
Flip chip
Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems , to external circuitry with solder bumps that have been deposited onto the chip pads...
ball grid array
Ball grid array
A ball grid array is a type of surface-mount packaging used for integrated circuits.- Description :The BGA is descended from the pin grid array , which is a package with one face covered with pins in a grid pattern. These pins conduct electrical signals from the integrated circuit to the printed...
(BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level chip-scale package (WL-CSP) or a wafer-level package (WLP).
Types of chip scale packages
Chip scale packages can be classified into the following groups:- Customized leadframe-based CSP
- Flexible substrate-based CSP
- Flip-chip CSP (FCCSP)
- Rigid substrate-based CSP
- Wafer-Level redistribution CSP (WL-CSP)
External links
- Chip Scale Package – Definition and general information, from SiliconFarEast.com
- Wafer-Level Packaging – From SiliconFarEast.com
- Chip Scale Review – A trade magazine
- Wikihowto: Guide to IC packages
- http://extra.ivf.se/ngl/D-CSP/ChapterD.htm The Nordic Electronics Packaging Guideline, Chapter D: Chip Scale Packaging