A single in-line package (or SIP) is an electronic device package which has one row of connecting pins. It is not as popular as the dual in-line package

Dual in-line package

In microelectronics, a dual in-line package is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.A DIP is usually referred to as a DIPn, where n is...

 which contain two rows of pins, but has been used for packaging RAM

Ram

-Animals:*Ram, an uncastrated male sheep*Ram cichlid, a species of freshwater fish endemic to Colombia and Venezuela-Military:*Battering ram*Ramming, a military tactic in which one vehicle runs into another...

 chips and multiple resistors with a common pin. SIPs group RAM chips together on a small board either by the DIP process or surface mounting SMD process. The board itself has a single row of pin-leads that resembles a comb extending from its bottom edge, which plug into a special socket on a system or system-expansion board. SIPs are commonly found in memory modules

Memory module

Memory module is a broad term used to refer to a series of dynamic random access memory integrated circuits modules mounted on a printed circuit board and designed for use in personal computers, workstations and servers....

. As compared to DIPs with a typical maximum I/O count of 64, SIPs have a typical maximum I/O count of 24 with lower package costs.

According to Computer Hope SIP is not to be confused with SIPP which is an archaic term referring to Single In-line Pin Package which was a memory used in early computers.

See also

• Dual in-line package
  Dual in-line package
  In microelectronics, a dual in-line package is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.A DIP is usually referred to as a DIPn, where n is...
  
   (DIP)
• Zig-zag in-line package
  Zig-zag in-line package
  The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in-line packaging . A ZIP is an integrated circuit encapsulated in a slab of plastic, measuring about 3 mm x 30 mm...
  
   (ZIP)
• Single in-line memory module (SIMM)
• Rambus in-line memory module (RIMM)
• Dual in-line memory module (DIMM)
• Chip carrier
  Chip carrier
  A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
  
  - Chip packaging and package types list