Anodic bonding
Encyclopedia
Anodic bonding is a wafer bonding
procedure without any intermediate layer. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon
/glass
and metal
/glass
through electric field
s. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions. The coefficient of thermal expansion (CTE) of the processed glass needs to be similar to those of the bonding partner.
Anodic bonding can be applied with glass wafers at temperatures of 250 to 400 °C or with sputtered glass at 400 °C.
This procedure is mostly used for hermetic encapsulation of micro-mechanical silicon elements. The glass substrate encapsulation protects from environmental influences, e.g. humidity or contamination. Further, other materials are used for anodic bonding with silicon, i.e. low-temperature cofired ceramics (LTCC).
Overview =
Anodic bonding on silicon substrates is divided into bonding using a glass wafer or a glass layer. The glass wafer is often sodium containing Borofloat or Pyrex glasses. With an intermediate glass layer, it is also possible to connect two silicon wafers. Those glass layers are deposited by sputtering, spin-on of a glass solution or vapor deposition upon the processed silicon wafer. The thickness of these layers is typically a few micrometer but at least 2 µm contrary to spin-on glasses whereas the thickness is about 1 µm or less.
Also hermetic seals of silicon to glass bonds using an aluminium layer with thickness of 50 to 100 nm are achieved, reaching strengths of 18.0 MPa. This method enables burying electrically isolated conductors in the interface.
Further, bonding of thermally oxidized wafers without a glass layer is possible.
The procedural steps of anodic bonding are divided into the following:
The major drawback of anodic bonding is the different coefficients of thermal expansion for the used materials, silicon and glass. This mismatch can harm the bond through intrinsic material tensions within the used materials and cause disruptions in the bonding materials. The use of sodium containing glasses, e.g. Borofloat or Pyrex, supports to prevent this mismatch. Those glasses have a similar CTE in a specific range of applied temperature commonly up to 400 °C.
The anodic bonding process is characterized by following variables:
The typical bond strength is between 10 and 20 MPa and according to pull tests higher than the fracture strength of glass.
History =
Anodic bonding is first mentioned by Wallis and Pomerantz in 1969. It is applied as bonding of silicon wafers to sodium containing glass wafers under the influence of an applied electric field. This method is used up to date as encapsulation of sensors with electrically conducted glasses.
The glass wafer can also be chemically etched or sand blasted for creating small cavities, where MEMS devices can be accommodated.
Further mechanisms supporting the bonding process of not completely inert anodic materials can be the planarization or polishing of surfaces and the ablation of the surface layer by electrochemical etching.
The anodic bonding procedure is based on a glass wafer that is usually placed above a silicon wafer. An electrode is in contact with the glass wafer either through a needle or a full area cathode electrode.
If using a needle electrode, the bond spreads radially to the outside which makes it impossible to trap air between the surfaces. The radius of the bonded area equals approximately the radical of the passed time. Below temperatures of 350 to 400 °C and a bond voltage of 500 to 1000 V, this method is not very effective nor reliable.
The use of a full area cathode electrode shows bond reactions all over the interface after powering up the potential. This results from creating a homogeneous electric field distribution at temperatures of around 300 °C and bond voltage of 250 V.
The wafers are placed between the chuck and the top tool used as bond electrode at temperatures between 200 and 500 °C (compare to image "scheme of anodic bonding procedure") but below the softening point of glass (glass transition temperature). The higher the temperature the better is the mobility of positive ions in glass.
The applied electrical potential between is set to a voltage of several 100 V. This causes a diffusion of sodium ions (Na+) out of the bond interface to the backside of the glass to the cathode. That results, combined with humidity in formation of NaOH. High voltage helps to support the drifting of the positive ions in glass to the cathode. The diffusion is according to the Boltzmann distribution exponentially related to the temperature. The glass (NaO2) with its remaining oxygen ions (O2-) is negatively volume charged at the bonding surface compared to the silicon (compare to figure "ion drifting in bond glass" (1)). This is based on the depletion of Na+ ions.
Silicon is unlike, e.g. aluminium, an inert anode. In result no ions drift out of the silicon into the glass during the bond process. This affects a positive volume charge in the silicon wafer on the opposite side. As a result a few micrometer thick high-impedance depletion region is developed at the bond barrier in the glass wafer. In the gap between silicon and glass the bond voltage drops. The bond process as a combination of electrostatic and electrochemical process starts.
The electrical field intensity in the depletion region is so high that the oxygen ions drift to the bond interface and pass out to react with the silicon to form SiO2 (compare to figure "ion drifting in bond glass" (2)). Based on the high field intensity in the depletion region or in the gap at the interface, both wafer surfaces are pressed together at a specific bond voltage and bond temperature. The process is realized at temperatures from 200 - 500 °C for about 5 to 20 min. Typically, the bonding or sealing time becomes longer when temperature and voltage are reduced. The pressure is applied to create intimate contact between the surfaces to ensure good electrical conduction across the wafer pair. This ensures intimate contact for the surfaces of the bonding partners. The thin formed oxide layer between the bond surfaces, siloxane (Si-O-Si), ensures the irreversible connection between the bonding partners.
If using thermally oxidized wafers without a glass layer, the diffusion of OH- and H+ ions instead of Na+ ions leads to the bonding.
Technical specifications =
See also =
External links =
Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems , nanoelectromechanical systems , microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation...
procedure without any intermediate layer. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon
Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. A tetravalent metalloid, it is less reactive than its chemical analog carbon, the nonmetal directly above it in the periodic table, but more reactive than germanium, the metalloid directly below it in the table...
/glass
Glass
Glass is an amorphous solid material. Glasses are typically brittle and optically transparent.The most familiar type of glass, used for centuries in windows and drinking vessels, is soda-lime glass, composed of about 75% silica plus Na2O, CaO, and several minor additives...
and metal
Metal
A metal , is an element, compound, or alloy that is a good conductor of both electricity and heat. Metals are usually malleable and shiny, that is they reflect most of incident light...
/glass
Glass
Glass is an amorphous solid material. Glasses are typically brittle and optically transparent.The most familiar type of glass, used for centuries in windows and drinking vessels, is soda-lime glass, composed of about 75% silica plus Na2O, CaO, and several minor additives...
through electric field
Electric field
In physics, an electric field surrounds electrically charged particles and time-varying magnetic fields. The electric field depicts the force exerted on other electrically charged objects by the electrically charged particle the field is surrounding...
s. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions. The coefficient of thermal expansion (CTE) of the processed glass needs to be similar to those of the bonding partner.
Anodic bonding can be applied with glass wafers at temperatures of 250 to 400 °C or with sputtered glass at 400 °C.
This procedure is mostly used for hermetic encapsulation of micro-mechanical silicon elements. The glass substrate encapsulation protects from environmental influences, e.g. humidity or contamination. Further, other materials are used for anodic bonding with silicon, i.e. low-temperature cofired ceramics (LTCC).
Overview =
Anodic bonding on silicon substrates is divided into bonding using a glass wafer or a glass layer. The glass wafer is often sodium containing Borofloat or Pyrex glasses. With an intermediate glass layer, it is also possible to connect two silicon wafers. Those glass layers are deposited by sputtering, spin-on of a glass solution or vapor deposition upon the processed silicon wafer. The thickness of these layers is typically a few micrometer but at least 2 µm contrary to spin-on glasses whereas the thickness is about 1 µm or less.
Also hermetic seals of silicon to glass bonds using an aluminium layer with thickness of 50 to 100 nm are achieved, reaching strengths of 18.0 MPa. This method enables burying electrically isolated conductors in the interface.
Further, bonding of thermally oxidized wafers without a glass layer is possible.
The procedural steps of anodic bonding are divided into the following:
- Contact substrates
- Heating up substrates
- Bonding by the application of an electrostatic field
- Cooling down the wafer stack
The major drawback of anodic bonding is the different coefficients of thermal expansion for the used materials, silicon and glass. This mismatch can harm the bond through intrinsic material tensions within the used materials and cause disruptions in the bonding materials. The use of sodium containing glasses, e.g. Borofloat or Pyrex, supports to prevent this mismatch. Those glasses have a similar CTE in a specific range of applied temperature commonly up to 400 °C.
The anodic bonding process is characterized by following variables:
- bond voltage UB
- bond temperature TB
- current limitation IB
The typical bond strength is between 10 and 20 MPa and according to pull tests higher than the fracture strength of glass.
History =
Anodic bonding is first mentioned by Wallis and Pomerantz in 1969. It is applied as bonding of silicon wafers to sodium containing glass wafers under the influence of an applied electric field. This method is used up to date as encapsulation of sensors with electrically conducted glasses.
Pretreatment of the substrates
The anodic bonding procedure is able to bond hydrophilic and hydrophobic silicon surfaces equally effective. The roughness of the surface should be less than 10 nm and free of contamination on the surface. Even though anodic bonding is relatively tolerant to contaminations, a wide established cleaning procedure RCA takes place to remove those surface impurities.The glass wafer can also be chemically etched or sand blasted for creating small cavities, where MEMS devices can be accommodated.
Further mechanisms supporting the bonding process of not completely inert anodic materials can be the planarization or polishing of surfaces and the ablation of the surface layer by electrochemical etching.
Contact the substrates
The wafers that meet the requirements are put into atomic contact. As soon the first contact is established, the bonding process starts close to the cathode, spreading in fronts to the edge. This bonding process takes several minutes.The anodic bonding procedure is based on a glass wafer that is usually placed above a silicon wafer. An electrode is in contact with the glass wafer either through a needle or a full area cathode electrode.
If using a needle electrode, the bond spreads radially to the outside which makes it impossible to trap air between the surfaces. The radius of the bonded area equals approximately the radical of the passed time. Below temperatures of 350 to 400 °C and a bond voltage of 500 to 1000 V, this method is not very effective nor reliable.
The use of a full area cathode electrode shows bond reactions all over the interface after powering up the potential. This results from creating a homogeneous electric field distribution at temperatures of around 300 °C and bond voltage of 250 V.
Heating and bonding by application of electrostatic field
The wafers are placed between the chuck and the top tool used as bond electrode at temperatures between 200 and 500 °C (compare to image "scheme of anodic bonding procedure") but below the softening point of glass (glass transition temperature). The higher the temperature the better is the mobility of positive ions in glass.
The applied electrical potential between is set to a voltage of several 100 V. This causes a diffusion of sodium ions (Na+) out of the bond interface to the backside of the glass to the cathode. That results, combined with humidity in formation of NaOH. High voltage helps to support the drifting of the positive ions in glass to the cathode. The diffusion is according to the Boltzmann distribution exponentially related to the temperature. The glass (NaO2) with its remaining oxygen ions (O2-) is negatively volume charged at the bonding surface compared to the silicon (compare to figure "ion drifting in bond glass" (1)). This is based on the depletion of Na+ ions.
Silicon is unlike, e.g. aluminium, an inert anode. In result no ions drift out of the silicon into the glass during the bond process. This affects a positive volume charge in the silicon wafer on the opposite side. As a result a few micrometer thick high-impedance depletion region is developed at the bond barrier in the glass wafer. In the gap between silicon and glass the bond voltage drops. The bond process as a combination of electrostatic and electrochemical process starts.
The electrical field intensity in the depletion region is so high that the oxygen ions drift to the bond interface and pass out to react with the silicon to form SiO2 (compare to figure "ion drifting in bond glass" (2)). Based on the high field intensity in the depletion region or in the gap at the interface, both wafer surfaces are pressed together at a specific bond voltage and bond temperature. The process is realized at temperatures from 200 - 500 °C for about 5 to 20 min. Typically, the bonding or sealing time becomes longer when temperature and voltage are reduced. The pressure is applied to create intimate contact between the surfaces to ensure good electrical conduction across the wafer pair. This ensures intimate contact for the surfaces of the bonding partners. The thin formed oxide layer between the bond surfaces, siloxane (Si-O-Si), ensures the irreversible connection between the bonding partners.
If using thermally oxidized wafers without a glass layer, the diffusion of OH- and H+ ions instead of Na+ ions leads to the bonding.
Cooling down the substrate
After the bonding process a cooling for several minutes has to take place. This can be supported by purging an inert gas. The cooling time depends on the difference of CTE for the bonded materials. The higher the CTE difference is the slower the cooling down should be proceeded.Technical specifications =
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- Wafer bondingWafer bondingWafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems , nanoelectromechanical systems , microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation...
- Direct bondingDirect bondingDirect bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements....
- Plasma activated bondingPlasma activated bondingPlasma activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal...
- Eutectic bondingEutectic bondingEutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer. Those eutectic metals are alloys that transform directly from solid to liquid state at a specific composition and temperature without passing a two phase equilibrium, i.e...
- Glass frit bondingGlass frit bondingGlass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, i.e. accelerometers or gyroscopes. This technique utilizes low...
- Adhesive bondingAdhesive bondingAdhesive bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced connections can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate...
- Thermocompression bondingThermocompression bondingThermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold -gold , are brought into atomic contact applying force and heat simultaneously. The diffusion...
- Reactive bondingReactive bondingReactive bonding describes a wafer bonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates. The multilayer system consists of two alternating different thin metallic films. The self-propagating exothermic reaction within the...
- Measurement and characterization for wafer level packaging technologiesBond characterizationThe wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void formation in the interface due to unevenness or impurities...
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