TIA J-STD-607
Encyclopedia
Covering the grounding and bonding requirements for a building’s electrical system and telecommunications cabling infrastructure, TIA J-STD-607-B is an American National Standard created by the Telecommunications Industry Association
Telecommunications Industry Association
The Telecommunications Industry Association is accredited by the American National Standards Institute to develop voluntary, consensus-based industry standards for a wide variety of ICT products, and currently represents nearly 400 companies...

, which facilitates the design and installation of telecom grounding/bonding systems.

Grounding and bonding not only save lives by preventing electrical hazards, they also maintain a network’s overall performance by ensuring that electromagnetic “noise” doesn’t interfere with data transmission
Data transmission
Data transmission, digital transmission, or digital communications is the physical transfer of data over a point-to-point or point-to-multipoint communication channel. Examples of such channels are copper wires, optical fibres, wireless communication channels, and storage media...

. Whether the telecommunications system is based on Shielded Twisted Pair (STP) or Unshielded Twisted Pair (UTP) cable, TIA J-STD-607-B requires that each and every metallic component making contact with a telecom cabling infrastructure be bonded, even if it is merely touching another metal component that is directly attached.

According to the standard, proper infrastructure
Infrastructure
Infrastructure is basic physical and organizational structures needed for the operation of a society or enterprise, or the services and facilities necessary for an economy to function...

 bonding requires the following elements: a telecommunications main grounding busbar (TMGB), telecommunications grounding busbars (TGB), telecommunications bonding busbars (TBB), grounding equalizers (GE), and a bonding conductor for telecommunications (BCT). Among TIA J-STD-607-B’s list of metallic components in need of bonding are racks, enclosures, ladders, surge protectors, cable trays, routers, switches and patch panels.

Following the bonding of telecom infrastructure components, the entire system must be bonded to the building’s main ground, which is sometimes also referred to as a grounding electrode system.
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