Applications

• Tape automated bonding (TAB), chip on film (COF), lead lock tape, high density Flexible Printed Circuit FPC), stiffener for FPC, office automation equipment, flexible solar cells, Speaker diaphragms (for mobile phones, plasma televisions and car audio, etc), heavy electric machinery, office automation equipment, thermal control film for satellites, Printed circuit boards, metallic substrates, sheet heating elements, heat resistance wires.

Characteristics

• Physical, mechanical, electrical, and chemical properties under high-temperature conditions.
• High tensile strength and modulus, and also features outstanding long-term heat resistance